2018/11/17  
Winbond announces plan to invest NT$335 billion in 12-inch wafer plant in Kaohsiung Science Park (2017/09/26)
其它新聞 Other News   
  • Premier Lai Ching-te backs continued cross-strait exchange in face of legislative questioning
  • Kaohsiung Opens Light Rail
  • Taking a page from Denmark’s low-carbon island Samso, Taiwan’s Miniwiz forges its own path
  • Domestic foundation readies NT$2 billion regulatory reform drive on regenerative medicine
  • Taichung’s Horticultural Diplomacy
  • Melon Farmer from West Java
  • 英文 English 
    Winbond announces plan to invest NT$335 billion in 12-inch wafer plant in Kaohsiung Science Park (2017/09/26)

    Though it’s still waiting to conclude a blockbuster deal with TSMC, Kaohsiung looks set to welcome DRAM chip-maker Winbond Electronics, which has announced plans to invest NT$335 billion toward a new plant in the southern city. Construction of the plant is estimated to begin in July of next year, with volume production expected in 2020.

    Dynamic random access memory chip manufacturer Winbond Electronics has announced plans to build a 12-inch wafer manufacturing plant in the Kaohsiung section of the Southern Taiwan Science Park.

    Arthur Chao
    Winbond Electronics Chairman
    We’ll start by making DRAM wafers first. After working for many years, we’ve developed our own technology for manufacturing DRAM. I estimate by 2020, when the facility is expected to go into operation, we will be using a 25 to 20-nanometer process for mass production.

    Chen Liang-gee
    Science and Technology Minister
    This may be only on the technological front, but the project will have a broader effect, creating a number of related jobs in technical support about four to five times (that at the factory alone).

    Winbond expects to invest NT$335 billion in the project, and plans to begin commercial production there by 2020, which will require 2,500 or so high-skilled workers.

    Chen Chu
    Kaohsiung Mayor
    For us, this project is a dream come true. We’re currently in the midst of preparatory work, and will break ground in July of next year.

    If all goes well, Winbond’s wafer plant will go down in the record books as the biggest investment project in the history of Kaohsiung’s electronics industry.
    中文 Chinese  
    華邦電投資12吋晶圓廠 落腳南科高雄園區

    高雄爭取台積電進駐一直沒下文,DRAM大廠華邦電子則是正式宣布,12吋晶圓廠落腳南科高雄園區,總投資金額高達3350億元,這是高雄電子業有史以來,規模最大的單一投資案,預計明年七月動土。

    DRAM大廠華邦電子12吋晶圓廠,確定落腳南科高雄園區。

    [[華邦電董事長 焦佑鈞]]
    “我們初期會以DRAM為主要產品,因為我們現在經過多年的努力,已經擁有自己開發DRAM製程技術的能力,我們預期在2020導入的時候,會以25奈米到20奈米的製程技術進入量產”

    [[科技部長 陳良基]]
    “它雖然只有科技的部份,但是其實它帶動的是整個協力,跟支援相關科技的工作,大概是四到五倍整個擴散的力量”

    華邦電預計投資3350億,2020年開始量產,需要2500個高階人才。

    [[高雄市長 陳菊]]
    “對我們來講,我們是夢寐以求,現在很多準備工作都在做,明年七月就動土”

    在卸任前,陳菊交出高雄電子業有史以來,規模最大的經濟投資案的經濟成績單。
    關於民視 常見問題 如何收看民視 意見信箱

    © 2009 FTV All Rights Reserved 版權所有‧盜用必究 Designed by FTV
    地址:244 新北市林口區信義路99號   觀服電話:(02)8601-8601 服務時間:週一至週日09:00-21:00   傳真:(02)8601-3955

    本網站使用 cookie 與其他技術為您提供更好的使用體驗, 請閱讀我們的的隱私權政策,通過使用我們的網站,表示您確認並同意我們的政策。